Skala standar saka rolledFoil Tembaga Murnipunika (0,05 ～ 0,010) mm (kekandelan) & kaping; (40 ~ 600) mm (jembaré), lan dawane umume ora kurang saka 5000mm nalika diwenehake ing gulungan. Kahanane alus lan atos, lan akeh-akehe atos. Ciri-cirine yaiku: susunan sing apik, fungsi seragam; Rampung lumahing dhuwur, layanan umum apik; siji kekandelan minimal lan jembaré diwatesi. Foil tembaga sing digulung bisa dipérang dadi foil tembaga tanpa oksigen kanggo tabung elektron, foil tembaga tanpa oksigen lan foil tembaga abang miturut komposisi kimia, lan foil tembaga alloy tahan karat kanthi unsur tilak lan foil tembaga alloy tahan panas ditambahake. Foil tembaga murni utamane digunakake kanggo papan sirkuit cetak fleksibel, papan cetak sirkuit karton, kaset pelindung elektromagnetik, kabel datar komposit, gulungan lan elektroda lapisan baterei lithium. Karat-tahan alloy tembaga foil lan panas-tahan alloy tembaga foil sing biasane digunakake kanggo radiator, gaskets, brake pads, etc. Kanthi miniaturization komponen listrik lan elektronik, sawetara aplikasi saka tembaga lan tembaga foil bakal luwih akeh.
Foil Tembaga Murni(copper foil): a kind of cationic electrolytic material, a thin, continuous metal foil deposited on the base layer of the circuit board, which acts as the conductor of the PCB. It easily adheres to the insulating layer, accepts the printed protective layer, and forms a circuit pattern after corrosion. Copper mirror test (copper mirror test): a flux corrosion test, using a vacuum deposition film on the glass plate. Copper foil is made of copper and a certain proportion of other metals. Copper foil generally has 90 foil and 88 foil, that is, the copper content is 90% and 88%, and the size is 16*16cm. Copper foil is the most widely used. Decorative materials. Such as: hotels, temples, Buddha statues, golden signs, tile mosaics, crafts.Foil Tembaga Murniiku pilihan apik.
